Vision,Mission and Values
World Wide SATS Ranking
NINE KEY PACKAGING AND TESTING TECHNOLOGIES
SiP-SYSTEM IN PACKAGE TECHNOLOGY
MIS (Molded Interconnect System) Packaging Technology
BGA Packaging Technology
EHS Policy and Management
EICC Policy and Commitment
Conflict Free Mineral Policy
Product Hazardous Substance Management
Information Security Management Policy
Discrete New Product...
IC New Products
SiP New Products
Packaging Material N...
Monthly Shipment of WLCSP from JCAP exceeds 600 Million
Good news from STATS ChipPAC: the eWLB expansion project is up to standard and i...
Chairman Wang Xinchao accepts the appointment as a member of Jiangsu Constructio...
STATS ChipPAC Jiangyin Semiconductor Co., Ltd.: the first batch of production eq...
New factory of the Integrated Circuit Center is relocated smoothly
JCET’s factory in South Korea JSCK is completed
Director-General of the National IC Packaging and Testing Industry Chain Technol...
Secretary of CPC Jiangsu Provincial Committee Li Qiang visits JCET
Chairman Wang Xinchao Receives “SEMI Person of the Year” Award
SMIC and JCET Establish a Joint Venture in Jiangyin National High-Tech Industria...
SMIC and JCET Establish a Joint Venture to Build China's Local IC Manufacturing ...
The “research and industrialization of high-capacity flash memory system-level i...
The “research and industrialization of FBP” won the Second Prize of “Jiangsu Sci...
JCET won the honorary tile “Advanced Enterprise for Export Incremental Contribut...
The “IC discrete devices FBP and its package structure” won the Golden Prize of ...
JCET won the “BYD Supplier Excellence Award 2011” and the SILERGY CORP’s “Best S...
JCET won the Jiangsu Advanced Unit for Technical Innovation in the 11th Five Yea...
JCET won the title “Top 10 Technical Innovative Enterprises”
JCET’s FBP technology won the Golden Prize of the 13th China Patent Award
JCET won the “Wuxi Mayor Quality Award 2011”
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